type dfn s1-mlecpi revision 00 checked ne date 14.10.2002 page 30 h i g h f r e q u e n c y m i n i a t u r e s u r f a c e m o u n t p x o d f n s 1 - m l e c p i ( 3 . 3 v ) key features 600 to 800 mhz 20 ppm/15 years stability available parametric frequency multiplication 0.4 ps rms jitter over 50 khz to 80 mhz b.w. applications oc-192/sonet/sdh function dfn s1 n/c 1 e / d 2 gnd 3 output 1 4 output 2 5 vcc 6 type dfn s1-mlecpi frequency range 600 to 800 mhz standard frequencies 622.0800; 644.5313; 666.5143; 6 69.3266; 693.4828; 777.6000 mhz electrical specifications supply voltage 3.3 v 5 % supply current (no load) 60 ma output load lvpecl 100 k ( 50 to 1.3 v ) duty cycle @ 50% level 45/55...55/45 % rise/fall times ( 20 to 80% ) 0.5 ns high/low levels 2.22 v/ 1.7 v jitter rms ( 12 khz to 5 mhz ) 0.10 ps typ; 0.15 ps jitter rms ( 12 khz to 20 mhz ) 0.15 ps typ; 0.20 ps jitter rms ( 50 khz to 80 mhz ) 0.40 ps typ; 0.50 ps enable / disable on pin 2 low or open = enable, high = disable complementary output on pin 5 180 phase shifted start up 10 ms @ 3.15 v frequency stability stability [ ppm ] and temperature code types temperature range stability code stability co de stability code stability code 0 to 70c 20 xb20 25 xb25 50 xb50 100 xb100 -10 to 70c 20 xi20 25 xi25 50 xi50 100 xi100 all types -40 to 85c 25 xe25 50 xe50 75 xe75 100 xe100 remark includes calibration at 25c, temperature, ageing, vcc and load changes 1 st year options stability over long life time a = 5 years b = 10 year s c = 15 years ordering code type + option code + frequency + stability / temper ature code example dfn s1-mlecpi 622.08 mhz xb20c pc board footprint 9.10.2 14.80.3 1.4 1.0 5.08 6 5 4 3 2 1 5.9 +0.1 -0.2 2.54 8.9 5.08 1.27
frequency control products type ordering code revision 03 checked ne date 23.07.2007 page generic ordering codes some examples type 1 2 3 4 5 6 frequency 7 8 9 10 11 pxo dfn 1 14 - k h z 68.736 mhz x h 100 vcxo dfv 14 - k h 32.768 mhz 100 a b 25 tcxo dfa s7 - k o a 16.384 mhz c 1 vc-tcxo dfav 36 - m h 10.000 mhz 40 c 2 /12 1. type code 2. version 3. package code 4. internal 5. output code through hole surface mount code dfn = cxo/pxo model no. 14 = dil 14 s1 = epoxy 14 x 9 mm not for t = ttl dfv = vcxo not for 4 = dil 8 s2 = epoxy 7 x 5 mm customer use h = hcmos dfa = tcxo customer use 20 = 20 x 20 mm s3 = epoxy 9 x 7 mm b = ttl & hcmos dfo = ocxo 36 = 36 x 27 mm s4 = epoxy 24 x 22 mm e = negative ecl 10kh dfav = vc-tcxo s5 = plastic 14 x 9 mm ec = pos. ecl 10kh/100k dft = fcxo s7 = epoxy 20 x 12 mm lec = lvpecl 100k s8 = epoxy 20 x 12 mm l = lvds s10 = ceramic 14 x 9 mm o = clipped square wave s11 = ceramic 7 x 5 mm s = sine wave s13 = epoxy 11 x 9 mm s15 = ceramic 5 x 3.2 mm s16 = ceramic 3.2 x 2.5 mm s17 = ceramic 2.5 x 2 mm 6. option code 7. pulling range 8. indication code 9. temperature (if needed) code general vcxo range z = tri-state x = overall frequency a= 0.5 to 4.5 v range a = 0 to 50c k = -30 to 60c l = low power model stability 1 year or center @ 2.5 v l = 0 to 60c r = -30 to 70c r = tight symmetry value in ppm long term ageing (only dil-14) b = 0 to 70c n = -30 to 75c p = complimentary outputs code m = -10 to 50c t = -30 to 85c g = inverted pin-out c= 0.5 to 10 v range d = -10 to 60c f = -40 to 70c t = external trimmer center @ 4.25 v i = -10 to 70c e = -40 to 85c a = internal trimmer void = temperature q = -20 to 60c g = -55 to 105c v = external control voltage stability only d= 0.3 to 3.0 v range c = -20 to 70c h = -55 to 125c y = external potentiometer center @ 1.65 v p = -25 to 75c i = enable/disable void = standard spec 10. frequency stability 11. supply voltage / long term ageing code frequency stability expressed in ppm, either as indicates the supply voltage value in volts for models offering different an overall tolerance or as temperatur e options of supply voltage for (vc)-tcxo stability only. indicates long term ageing for surface mount pxo non-standard specifications specifications that cannot be covered by the abov e codes will be issued a uni que specification number
frequency control products type hand. guidelines revision 04 checked ne date 21.09.2007 page 1 fordahl smd products : tape & reel dimensions direction of unreeling p1 p2 p0 k a d0 d1 b f e s w fordahl type frequency spec date orientation marker indicates pin 1 > 165 d i r e c t i o n o f p u l l i n g t lab el a b 1. 0 13 . 0 10 . 6 c d materials: carrier tape : conductive polycarbonate cover tape : polyester, antistatic coated reel : conductive or antistatic treated polystyrene product oscil. tape [mm] moq reel [mm] type a b e f k s t w d0 d1 p0 p1 p2 [pcs] a b c d s1 pxo vcxo tcxo 9.4 15 1.75 11.5 6.25 - 21.3 24 1.55 2.0 4.0 12 2.0 250 27.8 24.7 60 180 1000 30.5 26.1 100 330 s2 pxo vcxo tcxo 5.5 8.7 7.5 3.6 - 13.3 16 1.5 8 500 19.8 16.7 60 180 2000 21.4 17.0 100 330 s4 tcxo 26.5 26.5 20.2 7.5 40.4 37.5 44 1.0 32 250 49.6 45.2 100 330 s7 vcxo 13.2 20.2 14.2 9.5 28.4 25.3 32 2.0 24 250 39.6 35.2 100 330 tcxo 8.0 20 450 s8 pxo 13.2 20.2 14.2 5.3 28.4 25.3 32 2.0 20 600 39.6 35.2 100 330 250 please consult factory for details on s5, s11, s15, s16 and s17 notice 1. storage please store the products in room where temperature / humidity is stable. conditions should be: temperature : 5 to 35 c humidity : 30 to 60% rh if products are stored for more than a year, solderability may be degraded. please confirm it regularly. 2 . tra educate and guide a carrier to prevent rough handling. nsportation if you transport the products, please pack them so that the package will not be damaged by mechanical vibration / shock and please
frequency control products type hand. guidelines revision 05 checked ne date 29.10.2007 page rohs smd products soldering guidelines 1. washing conditions our non hermetic smd products are strictly non-washable as li quid cleaning solutions could penetrate the base to cap seal. no-washing type flux with no washing is highly recomm ended. please consult factory for any other process. 2. reflow soldering conditions reflow profile: 25 ts mi n ts ma x tp tl ts t l tp t 25c to peak temperature time profile data minimum preheat temperature ts min 150c maximum preheat temperature ts max 200c preheat time ts min to ts max 90 - 180 seconds average ramp-up rate ts max to tp 3c/second max. reflow temperature tl 217c reflow time tl 60 - 150 seconds peak temperature tp according to jedec j-std-020c peak time tp 20 - 40 seconds average down ramp rate 6c/seconds max. time 25c to peak temperature 8 min max. this profile is applicable for the following packages : s1, s2, s3, s4, s5, s7, s8, s11, s13, and s15 additional recommendations: ? do not vibrate during reflow soldering ? do not reflow solder on back side ? only one reflow is allowed ? solder adhesion may vary depending on the motherboard?s thermal capac ity and other factors hand soldering (not recommended): maximum temperature: 300c/5 sec, fine tipped soldering iron
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